Processing-Property Mapping of Flash-Sintered Wall Tile Bodies

Abstract

This study investigates the effects of furnace temperature (900 degrees C and 945 degrees C), applied electric field (50-200 V.cm-1), and current density (50-150 mA.mm-2) on the physical properties and microstructure of flash-sintered wall tile bodies. Water absorption, bulk density, and open porosity were measured and compared with an industrially fired reference sample. The processing-property map reveals that water absorption and density are influenced by the interaction between thermal and electrical parameters. Samples flash-sintered at 900 degrees C satisfied the ISO 10545-3 water absorption requirement (10-20 wt%), whereas some samples processed at 945 degrees C exhibited values below 10 wt%. Increasing furnace temperature and electric field lead to lower porosity, while higher current densities activate crystallization mechanisms and increase open porosity from 12.44% to 20.01%. These results demonstrate that simultaneous optimization of temperature, electric field, and current density is essential for tailoring wall tile properties via flash sintering (FS).