Coplan, MeryemGursoy, MehmetMercan, Emine SevgiliKaraman, Mustafa2025-10-102025-10-1020250169-43321873-5584https://doi.org/10.1016/j.apsusc.2025.164514https://hdl.handle.net/20.500.13091/10836Gursoy, Mehmet/0000-0003-2275-9096This study employs plasma-enhanced chemical vapor deposition (PECVD) to address the limitations of conventional techniques in fabricating pressure-sensitive adhesive (PSA) thin films and to introduce advanced functionalities. PECVD provides a solvent-free, environmentally sustainable approach, allowing precise control over film composition and properties. PSA thin films were synthesized using varying feed ratios of 2-ethylhexyl acrylate (EHA) and acrylic acid (AA) monomers. The optimized PSA film was synthesized at a substrate temperature of 5 degrees C, reactor pressure of 150 mTorr, plasma power of 50 W, and an AA/EHA monomer flow rate ratio of 1.5. The chemical, physical, and mechanical characteristics of the films were systematically evaluated. The optimized film demonstrated a shear strength of 158 N/cm2 and a peel strength of 0.87 N/25 mm. Furthermore, the film exhibited excellent solvent resistance and high durability.eninfo:eu-repo/semantics/closedAccessPSAPlasmaCoatingPECVDThin FilmArticle10.1016/j.apsusc.2025.1645142-s2.0-105014761087